M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Revision:SEMI M68-0720 - Current 1-0623 (technical revision)

1-0623 (technical revision)

pressure regulators

The specification and test methods details in this Document apply to mold resin compounds which is used for packaging

SEMI E83-0714 (technical revision)

and strength of pellicle films used for masks

M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Revision:SEMI M68-0720 - Current 1-0623 (technical revision)Wafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The metric, ZDD, quantifies the near edge curvature of wafers used in semiconductor device processing. Consideration should be given to the use of this or other proposed