G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 consumer가 각각의 목적에 따라 관련된

consumer가 각각의 목적에 따라 관련된 데이터를 그룹화 하는 메커니즘을 포함한다

The required specification is determined by the device and the process design

This Standard does not define terms which have been defined already in other referenced Standards

irritating and corrosive gas with a sharp

The user might use this document to check significant performance characteristics

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 consumer가 각각의 목적에 따라 관련된The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used