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備註：當條文中含有「應」的字眼，表示必須與此文件要求一致。若含有「可」、「建議」、「優先」、「傾向」，或利用註與相關文件說明者，則不須完全依說明執行。
E This Safety Guideline was editorially modified in December 2023 to add Note 9 and to correct a processing error
This Test Method applies only for 3-point bending method
Materials kinds or cleanliness are not defined
SEMI F85-0304 (first published)
M08100 - SEMI M81 - 単結晶シリコンカーバイド基板に存在する欠陥についてのガイド Revision:SEMI M81-0611 - Superseded 備註：當條文中含有「應」的字眼，表示必須與此文件要求一致。若含有「可」、「建議」、「優先」、「傾向」，或利用註與相關文件說明者，則不須完全依說明執行。NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Compound Semiconductor Materials Global Technical Committee2011513global Audits and Reviews Subcommittee20116www. semiviews. org www. semi. org SEMI M55 SiCSiC SiC Referenced SEMI Standards SEMI M55 Specification for Polished
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