G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive SEMI E125-0709 (technical revision)

SEMI E125-0709 (technical revision)

This Standard does not apply to computing devices of programmable logic controllers (PLCs)

A sample data format for the test chip can be found in Appendix 1

orgで入手可能となる。初版は2000年10月発行。

This Standard provides specification for interconnection dimensions and performance requirements for permanent microfluidic interfaces

G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive SEMI E125-0709 (technical revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers