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G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title The edge lengths specified range

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Description

The edge lengths specified range from 202

3-0600 (Withdrawn 0811) — Specification for Rectangular Polished Monocrystalline Indium Phosphide Wafers

Intended Audience — This Standard is intended for use by OEMs

本基準提供半導體設備製造商在生產半導體製造設備時應考量之事項,藉以協助他們評估及降低對設備及產品產生火災與燃燒副產物之風險。

さらに,高密度の集積回路のエレメントの寸法をますます小さくするためのテクノロジの進歩につれ,エピタキシャルウェーハの特性をさらに標準化することに関心が集まってきている。

G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title The edge lengths specified rangeglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org19801997 : DIP Referenced SEMI Standards SEMI G10 Standard Method for Mechanical Measurement of Plastic Package Leadframes SEMI G18 Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

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